MOJAY Semiconductor Attends 2026 Shenzhen Smart Sensor Industry Exchange Conference, Exploring Empowerment Paths and Building Industrial Ecosystem Together

At 15:00 on February 5, 2026, the 2026 Shenzhen Smart Sensor Industry Empowerment & Ecosystem Cooperation Exchange Conference and Annual Meeting was grandly held in the conference hall on the 28th floor of the Science & Technology Finance Building, Guangming District, Shenzhen. As a National High-Tech Enterprise and a specialist deeply engaged in SoC chip design, Shenzhen MOJAY Semiconductor Co., Ltd. (hereinafter referred to as MOJAY Semiconductor) sent its Chairman Wang Jian as the invited attendee. He gathered with industry peers, experts, scholars and representatives of relevant institutions to discuss new trends in the smart sensor industry, explore new paths for industrial empowerment, and jointly build a new ecosystem for coordinated development.
Centered on industrial empowerment and ecological collaboration, the conference featured three key sessions: industry reports, project releases and new member certification. It comprehensively covered critical industrial dimensions including technology, standards, talent, market and finance. A premium platform was established for upstream and downstream enterprises in the smart sensor industry to conduct efficient connection and in-depth cooperation, helping enterprises seize industry opportunities, tackle development challenges and advance high-quality industrial growth. It is estimated that China’s smart sensor market size will reach RMB 380 billion in 2025 with a year-on-year growth rate exceeding 22%. The explosive demand from downstream sectors such as industrial automation, smart home and robotics has created broad development space for sensor chip vendors.
At the conference, the *2025 Shenzhen Smart Sensing Industry Cluster Research Report* was officially released. It systematically sorted out the development status, cluster strengths, existing bottlenecks and future trends of Shenzhen’s smart sensing industry in 2025, providing vital references for participating enterprises to accurately capture industry dynamics and formulate development strategies. During the core project release session, a host of important resources were unveiled:
Technology: The launch of packaging & testing platforms and inspection platforms will further improve the technical support system of the smart sensor industry and help enterprises boost product reliability and competitiveness. This forms strong complementarity with MOJAY Semiconductor’s chip R&D business and lays the groundwork for future technical collaboration.
Standards: The release of laboratory sensor application standards will drive standardized industrial development and help address the industry pain point of inconsistent standards.
Talent: Interpretations of professional training and talent introduction policies offer clear guidelines for building industrial talent pipelines, and open new avenues for MOJAY Semiconductor to recruit core R&D talents and strengthen its team.
Market: Announcements of overseas expansion platforms, industry exhibitions, HarmonyOS applications and market demands in home appliances and robotics precisely match the application scenarios of MOJAY’s products, creating important opportunities for the company to expand market presence and deepen field deployment.
Finance: The rollout of Guangming Qihang Venture Capital Fund and special sensing loans will provide diversified financial support for industrial enterprises, easing capital pressure on R&D investment and capacity expansion.
A new member certification ceremony was arranged in the agenda. On behalf of MOJAY Semiconductor, Chairman Wang Jian received the membership certificate. The company officially became a core member of this industrial exchange platform. With profound insight into industry evolution and solid corporate competence, MOJAY Semiconductor drew wide attention and recognition from attendees, accumulating valuable resources for diversified cooperation and further industrial layout in the future.
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