
The M1040 inductive encoder IC is a dedicated chip designed for high-precision position detection in industrial scenarios. Adopting advanced inductive encoding technology based on the inductive eddy current induction principle, it enables accurate measurement of the position and angle of rotating objects, and can directly replace traditional optical encoders and magnetic encoders.
This chip supports multiple angle signal output modes including ABZ, SPI and I2C, featuring high resolution and excellent anti-interference performance. It can stably acquire angle and position data even in complex industrial electromagnetic environments. Packaged in a TSSOP16 package, the chip facilitates the miniaturization design of sensor products and is compatible with a variety of industrial devices. It is widely applied in scenarios requiring rotation angle and position detection, such as industrial automation, servo control, robots and intelligent equipment, providing a highly reliable core encoder chip solution for industrial sensing systems.
Automated production lines
CNC machine tools
Robot joint control
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Auto Calibration for Offset Voltage & Gain
Angle Measurement Accuracy after Calibration: ±0.01°
Supports Linearization Calibration with up to 32 Points
Max Rotational Speed: 600000rpm
Angle Conversion Rate up to 1MHz
Multiple Angle Data Output Interfaces: SPI, I2C
Signal Transmission & Reception with PCB Inductor
Effective Resistance to Electromagnetic Interference, Stable Operation in Complex EMI Environment
| Category | Parameters |
| Detection Accuracy | ±0.01° |
| Max. Speed | 60万 rpm |
| Op. Temp. Range | -40°C ~ 125°C |
| Package Type | TSSOP16 |
| Safety Features |
Overvoltage, Undervoltage and Over-temperature Protection |
| Anti-interference | Immune to stray magnetic field interference |
| Accuracy | Calibrated angle measurement accuracy: ±0.01 ° |
| Temperature Drift |
Immune to external magnetic field interference, consistent accuracy across full temperature range |
| Environmental Adaptability |
Resistant to oil contamination, dust and high-vibration environments |
| System Integration Level | Single-chip solution, minimal external components, compact size |
| Output Type |
Supports multiple angle signal output interfaces including ABZ, SPI and I2C |

